Kindle Fire TearDown by iFixit shows internal components

For those who where wondering what hides behind the physical closed doors of the Kindle Fire, the guys from iFixit delivered the answer.

The teardown specialist website opened Amazon’s Kindle Fire in order to find out out of which components is the Kindle Fire made of. The already known details include the Texas Instruments OMAP 1GHz dual-core processor, 512 MB RAM, 8GB storage and 1024×600 LCD display.

What it has been discovered is that the OMAP processor is indeed the TI’s OMAP 4430, the same processor that powers the BlackBerry PlayBook. Another component is the Kindle Fire’s battery of 4400 mAH that takes a lot of space inside the device measuring 4.6-inches tall. by 4.3-inches wide (external case measures 7.5-inches tall by 4.7-inches wide.)

The components or chips discovered inside the e-reader/tablet are :

• Texas Instruments OMAP 4430 Processor
• Samsung KLM8G2FEJA 8 GB Flash Memory
• Hynix H9TKNNN4K 512 MB of Mobile DDR2 RAM
• Texas Instruments 603B107 Fully Integrated Power Management IC with Switch Mode Charger
• Texas Instruments LCDS83B FlatLink 10-135 MHz Transmitter
• Jorjin WG7310 WLAN/BT/FM Combo Module
• Texas Instruments AIC3110 Low-Power Audio Codec With 1.3W Stereo Class-D Speaker Amplifier
• Texas Instruments WS245 4-Bit Dual-Supply Bus Transceiver
• Texas Instruments WL1270B 802.11 b/g/n Wi-Fi solution
  

Via : iFixit , PCWorld